Interconnect Modeling

2-D/3-D Interconnect Modeling
 
SiSoft performs 3D electromagnetic modeling of complex geometries (such as coupled vias, BGA ball fields or connectors) using Ansoft Corporation's HFSS and Q3D simulators, while 2D modeling of simple interconnect is performed using Quantum-SI, HSPICE, LINPAR or Ansoft's SpiceLink 2D Extractor. The output of these simulators is used to create a circuit model using coupled RLC elements, W-LINE lossy transmission line models, or where appropriate, S-parameters. These models are used when running Quantum-SI simulations and may be interconnected with IBIS or transistor level I/O buffer models and other interconnect to represent a complete topology.

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From Our Customers:

"We've worked with SiSoft to create IBIS-AMI models across our SerDes based PHY's in IBM technologies.  SiSoft has demonstrated continued leadership in SerDes modeling by first driving the development of the IBIS-AMI standard and then becoming the leading provider of IBIS-AMI model development, correlation and validation services."
 
Navraj Nandra, Director of Marketing, Analog/Mixed Signal IP, Synopsys


Synopsys - Leadership in SerDes Modeling
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