Interconnect Modeling

2-D/3-D Interconnect Modeling
SiSoft performs 3D electromagnetic modeling of complex geometries (such as coupled vias, BGA ball fields or connectors) using Ansoft Corporation's HFSS and Q3D simulators, while 2D modeling of simple interconnect is performed using Quantum-SI, HSPICE, LINPAR or Ansoft's SpiceLink 2D Extractor. The output of these simulators is used to create a circuit model using coupled RLC elements, W-LINE lossy transmission line models, or where appropriate, S-parameters. These models are used when running Quantum-SI simulations and may be interconnected with IBIS or transistor level I/O buffer models and other interconnect to represent a complete topology.

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From Our Customers:

"This is the second generation of Virtex technology where we have collaborated with SiSoft to develop and correlate IBIS-AMI models to reference simulations and hardware.  The combination of these IBIS-AMI models and SiSoft’s QCD provides customers with accurate simulation results at speeds more than 100 to 1000 times faster than traditional simulation methodologies, allowing customers to quickly optimize their designs for cost, reliability and performance.”

 Anthony Torza, senior product marketing manager at Xilinx


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