Home > Services > 2-D/3-D Interconnect Modeling Services


2-D/3-D Interconnect Modeling

SiSoft performs 3D electromagnetic modeling of complex geometries (such as coupled vias, BGA ball fields or connectors) using Ansoft Corporation's HFSS and Q3D simulators, while 2D modeling of simple interconnect is performed using Quantum-SI, HSPICE, LINPAR or Ansoft's SpiceLink 2D Extractor. The output of these simulators is used to create a circuit model using coupled RLC elements, W-LINE lossy transmission line models, or where appropriate, S-parameters. These models are used when running Quantum-SI simulations and may be interconnected with IBIS or transistor level I/O buffer models and other interconnect to represent a complete topology.
To learn more about SiSoft's consulting capabilities, please use the following links:

Technical Staff Interface Experience Quick-Turn SI
Signal Integrity Analysis Crosstalk Analysis Timing Analysis
Technology Assessments SI Design Reviews IBIS Model Generation
Package Design Interconnect Modeling Power Integrity
PCB Design Lab Validation Design Kit Development

To learn more about SiSoft's Training opportunities, please use the following links:

SI Training Methodology and Product Training Jump-Start Training
     Home | Contact © 2002-2008 Signal Integrity Software, Inc.