A comparison of modeled to measured results suggests that vias introduce dissipative loss beyond that predicted by modeling tools, especially at frequencies above 10 GHz. This session presents such a comparison based on measured results from several different test boards using different materials and layout approaches. It evaluates several hypotheses that might explain the additional loss, including leakage from radial TEM waves and interactions with ground vias. The conclusions are used to extend existing analytic via models and improve high-frequency behavior. The results of system correlations are presented, demonstrating signal path correlation up to 20 GHz.
Dr. Michael Steinberger, Lead Architect of Serial Channel Products, SiSoft
Eric Brock, Principal Member of Technical Staff, SiSoft
Donald Telian, Principal SI Consultant, SI Guys